This study introduces an advanced defect inspection model that utilizes object detection techniques to identify defects in Flip Chip cross-section images. The model serves as a valuable tool for failure analysis (FA) engineers working with Chip-on-Wafer (CoW) products by enhancing inspection precision and accuracy. save time and costs. reduce human error. https://www.roneverhart.com/Asus-F1400EA-SB34-14-HD-1366x768-Laptop-Intel-Core-i3-1115G4-3-0-GHz-8GB-DDR4-256GB-SSD-Intel-UHD-Graphics-Windows-11-p9785/